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Circuit board production process complete version
Visit:831 Date:2020-08-24
Today I bring you a complete version of the circuit board production process. I hope to give you a deeper understanding of circuit board production!

  Opening material
   Purpose: According to the requirements of the engineering data MI, cut into small pieces to produce plates on large sheets that meet the requirements. Small sheets that meet customer requirements.

   Process: large sheet → cutting board according to MI requirements → curium board → beer fillet\grinding → board out


   Purpose: According to the engineering data, drill the required hole diameter in the corresponding position on the sheet of the required size.

   process: stacked plate pin → upper plate → drilling → lower plate → inspection\repair

  Sink copper

  Purpose: Immersion copper is to deposit a thin layer of copper on the insulating hole wall by chemical method.

   process: rough grinding → hanging board → automatic copper immersion line → lower board → dip% dilute H2SO4 → thick copper

   graphics transfer

  Purpose: Graphic transfer is to transfer the image on the production film to the board

Process: (blue oil process): grinding plate → printing the first side → drying → printing the second side → drying → exploding → developing shadow → inspection; (dry film process): hemp board → pressing film → standing → right Position→Exposure→Standing→Development→Check

   Graphic plating

  Purpose: Pattern electroplating is to electroplate a copper layer with the required thickness and a gold-nickel or tin layer with the required thickness on the bare copper skin or hole wall of the circuit pattern.

   process: upper board → degreasing → second water washing → micro-etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower board

  Remove film

  Purpose: Use NaOH solution to remove the anti-plating coating film to expose the non-circuit copper layer.

   Process: water film: insert rack → soak alkali → rinse → scrub → pass machine; dry film: release board → pass machine


  Purpose: Etching is to use a chemical reaction method to corrode the copper layer of non-circuit parts.

 green oil

  Purpose: Green oil is to transfer the graphic of the green oil film to the board to protect the circuit and prevent the tin on the circuit when welding parts

   Process: grinding plate → printing photosensitive green oil → curium plate → exposure → developing; grinding plate → printing the first side → drying plate → printing the second side → drying plate


  Purpose: Characters are provided as a mark for easy identification

  Process: After the green oil finishes → cool and stand → adjust the screen → print characters → back

  Gold finger

  Purpose: to plate a nickel/gold layer of required thickness on the plug finger to make it more hard and wear-resistant

   process: upper plate → degreasing → washing twice → micro-etching → washing twice → pickling → copper plating → washing → nickel plating → washing → gold plating

   Tin plate (a technique in parallel)

  Purpose: spray tin is to spray a layer of lead tin on the bare copper surface that is not covered with solder mask to protect the copper surface from corrosion and oxidation, so as to ensure good soldering performance.

   process: micro-etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying


  Purpose: Organic gongs, beer board, hand gongs, hand-cutting methods to produce the shape required by customers through die stamping or CNC gong machine

   Description: The accuracy of the data gong machine board and the beer board is relatively high. The hand gong is second, and the minimum hand-cutting board can only make some simple shapes.


   Purpose: To pass electronic 100% testing to detect defects that affect functionality such as open circuits and short circuits that are not easy to find visually.

   Process: upper mold → release board → test → pass → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap

 Final inspection

  Purpose: To pass 100% visual inspection of the board's appearance defects, and to repair minor defects to avoid problems and defective boards from flowing out.

  Specific work flow: incoming materials → check information → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → processing → inspection OK

Links: Single sided PCBDouble sided PCBMultilayer PCBAluminum substrateCopper substrate
QQ :470621138   438489109
Add:No. 101, Building E, Shajing Heyi West Pioneer Park, Baoan District, Shenzhen, Guangdong

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