Visit：1614 Date：2020-08-24

PCB operation process, the following is the general production process:
1. Inner substrate (THIN CORE)
2. Inner layer circuit production (laminating) (Dry Film Resist Coat)
3. Inner circuit production (exposure) (Expose)
4. Inner circuit production (Develop) (Develop)
5. Inner layer circuit production (etching) (Etch)
6. Inner layer circuit production (remove film) (Strip Resist)
7. Lay-up (Lay-up)
8. Lamination (Lamination)
9. Drilling
10. Plating (Desmear & Copper Deposition)
11. Outlayer Dry Film Lamination (Outlayer Dry Film Lamination)
12. Outer circuit exposure (Expose)
13. After Exposed
14. Outer circuit development (Develop)
15. Outer layer circuit production (etching) (Etch)
16. Outer layer circuit production (remove film) (Strip Resist)
17. Production of solder mask (green paint) (Solder Mask)
18. Immersion gold (spray tin...) production (Electroless Ni/Au, HAL...)

PCB (Printed Circuit Board) PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. . Because it is made by electronic printing, it is called a "printed" circuit board. After the electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors can be avoided, and electronic components can be automatically inserted or mounted, automatic soldering, and automatic detection, ensuring the electronic equipment Quality improves labor productivity, reduces costs, and facilitates maintenance. The development of printed boards has evolved from single-layer to double-sided, multilayer and flexible, and still maintains their own development trends. Due to the continuous development of high precision, high density and high reliability, continuous reduction in size, cost reduction, and performance improvement, the printed board will still maintain a strong vitality in the future development of electronic equipment. Summary of domestic and foreign discussions on the future development trends of printed board manufacturing technology are basically the same, that is, towards high density, high precision, fine aperture, fine wire, fine pitch, high reliability, multilayer, high-speed transmission, light weight, The development of thin type, in terms of production, simultaneously increases productivity, reduces costs, reduces pollution, and adapts to the development of multi-variety, small-batch production. The technical development level of the printed circuit is generally represented by the line width, aperture, and thickness/aperture ratio of the printed circuit board.